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Mini 0.3MP MIPI Camera Module GC0308 Sensor 640x480

Product Details:

Place of Origin: Shenzhen,China
Brand Name: Sinoseen
Certification: RoHS
Model Number: XLS-11161-V1.0

Payment & Shipping Terms:

Minimum Order Quantity: 3
Price: negotiable
Packaging Details: Tray+Anti-static bag in carton box
Delivery Time: 2-3weeks
Payment Terms: T/T
Supply Ability: 500000 pieces/month
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Type: 0.3MP Camera Module Sensor: 1/6.5'' GC0308
Resolution: HD 648(H)X488(V) Dimensions: (customizable)
Lens FOV: 70°(optional) Focus Type: Fixed Focus
Interface: USB2.0 Feature: Low Power Consumption
High Light:

0.3MP MIPI Camera Module

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GC0308 Sensor MIPI Camera Module

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Mini Camera Module 640x480

Product Description

Introducing our mini 0.3MP GC0308 MIPI Camera Module, designed to offer efficient imaging with low power consumption. With a maximum resolution of 640x480 and a pixel size of 3.4µm x 3.4µm, it delivers clear and detailed images for a variety of applications.

Featuring an electronic rolling shutter, this camera module runs seamlessly at 30 frames per second at 640x480 resolution, and at 60 frames per second at 320x240 resolution. Its versatility extends to various devices including cellular phones, notebooks, security systems, and industrial applications.

The compact size of 30mm x 25mm allows for easy integration into a wide range of systems, while the USB2.0 interface ensures compatibility with multiple operating systems including Windows, Linux, macOS, and Android.

Experience enhanced imaging capabilities with our GC0308 MIPI Camera Module, offering reliability and performance in a compact form factor. Ideal for applications where low power consumption and high-quality imaging are essential.

Product Features

Compact Mechanical Design

The small optical assembly helps reserve more space for other components inside the device. Use the complete mechanical drawing to check the FPC routing, connector position, and installation clearance.

VGA Imaging for Basic Visual Tasks

A 640 × 480 image contains approximately 0.3 million pixels. For tasks that do not require fine-detail capture, this provides a practical image size with fewer pixels to transfer and process than higher-resolution formats at the same frame rate and pixel format.

Integrated Image Processing

The sensor’s built-in ISP supports automatic exposure and white balance. These functions help adapt image brightness and color balance to changes in scene lighting.

Multiple Sensor Output Formats

The supplied sensor information lists Bayer RGB, RGB565, and YCbCr 4:2:2 formats. Select the module configuration and output mode to match the host’s capture and processing capabilities.

85° Diagonal Scene Coverage

The supplied lens configuration specifies an 85° ± 3° diagonal field of view. Check the actual coverage at the intended working distance when positioning the camera.

Specification:0.3MP MIPI Camera Module

Model No

XLS-11161-V1.0

Sensor

1/ 6.5’’ GalaxyCore GC0308

Pixel

0.3 Mega Pixel

Most effective pixels

640 (H) x 480 (V)

Pixel Size

3.4µm x 3.4µm

Compression format

YUY2 ONLY

Resolution & Frame rate

640x480@30fps;

352x288@30fps;

320x240@30fps;

176x144@30fps;

160x120@30fps;

Shutter Type

Electronic rolling shutter

Focus type

Fixed focus

S/N ratio

49dB

Dynamic range

55dB

Sensitivity

3300mV/Lux-sec

Interface type

USB2.0

Adjustable parameter

Brightness/Contrast/Color saturation/Hue/Definition/Gamma

Audio frequency

Optional

Lens FOV

Default 60° (Optional)

Lens Thread Size

M12*P0.5 (Optional)

Power supply

USB BUS POWER

Power consumption

DC 5V, 70mW

Main chip

DSP/SENSOR/FLASH

Auto Exposure Control (AEC)

NOT Support

Auto White Balance (AEB)

NOT Support

Auto Gain Control (AGC)

NOT Support

Dimension

30mm x 25mm

Storage temperature

-30°C to 80°C

Operating temperature

0°C to 60°C

USB cable length

Default

Support OS

WinXP/Vista/Win7/Win8/Win10
Linux with UVC(above linux-2.6.26)
MAC-OS X 10.4.8 or later
Android 4.0 or above with UVC

GC0308-Sensor-Mini-0.3MPMIPI-Camera-Module-640x480

Application Areas

Face Recognition: Face capture for access control.
QR Code Payment: Code imaging for decoding.
VR Devices: Visual input for motion tracking.
High-Speed Tracking: Moving-object image capture.
Terminal Scanning: Document and barcode imaging.
Robot Vision: Images for positioning and guidance.
Security & Smart Home: Indoor and outdoor monitoring.
AI Training Data Collection: Image capture for AI datasets.
Medical & Life Science Imaging: Image capture for microscopy and research.

OEM/ODM Customization & Development Process


Match the Camera to Your Integration Requirements

A suitable camera configuration must fit both the imaging task and the device structure. Sinoseen provides OEM/ODM camera module services and can assess changes to the optical setup, flexible-circuit layout, connection arrangement, and supported operating configuration.

Project Requirement Areas for Engineering Review Information to Provide
The camera does not fit the enclosure Camera-head placement, FPC outline, and routing Mechanical drawings and available space
cene coverage or working distance is unsuitable Lens selection, field of view, and focus setting Target dimensions and capture distance
The host connection differs from the standard design Connector, pin assignment, and interface configuration Host specifications and connection requirements
Moving targets require sharper capture Exposure, lighting, and supported frame-rate modes arget speed, sample images, and lighting conditions
he project requires infrared imaging Filter and lens suitability Illumination wavelength and imaging requirements

Customization feasibility, development scope, cost, and lead time are confirmed after engineering review.

Customization Process

Step 1 — Share Your Requirements

Provide the application, host platform, required resolution and frame rate, working distance, installation space, and estimated quantity.

Step 2 — Review the Configuration

Assess the sensor operating mode, interface, lens, and mechanical arrangement. Identify any changes required for the target device.

Step 3 — Confirm Drawings and Evaluation Criteria

Agree on the configuration, connection details, mechanical revision, and sample acceptance requirements before prototype production.

Step 4 — Evaluate Samples

Test image quality, sustained frame rate, exposure behavior, host integration, and mechanical fit in the actual operating environment.

Step 5 — Approve the Production Configuration

Confirm the accepted sample, drawings, optical components, and operating configuration before proceeding with volume production.

Send Your Drawings and Imaging Requirements

About Sinoseen


Shenzhen Sinoseen Technology Co., Ltd. was established in June 2016 and specializes in CMOS camera module design, development, manufacturing, and OEM/ODM services.

Its product portfolio includes USB, MIPI, and DVP camera modules, with services extending from development through manufacturing and after-sales support.

For embedded vision projects, Sinoseen works with customers to assess the imaging task alongside mechanical and electrical integration requirements. This helps define a camera configuration that can be evaluated in the intended device before production approval.

Certifications & Intellectual Property


Sinoseen’s documentation includes quality management records, product compliance documents, software copyrights, and utility model patents. For your camera module project, please request the current documents applicable to the selected model and configuration, including relevant CE, FCC, or RoHS documentation.

Frequently Asked Questions


Q1: Is this an HD camera module?

It is a VGA camera module with a 640 × 480 output size. Evaluate whether this resolution captures the level of detail your application requires.

Q2: Why does the specification also list 648 × 488?

648 × 488 is the sensor active pixel array listed in the supplied information. VGA output is 640 × 480. The array size and output image size should be listed separately

Q3: Does the 6.5 × 6.5 mm size include the FPC and connector?

This dimension describes the base. Use the complete assembly drawing to determine the space required for the FPC, connector, and mounting arrangement.

Q4: Can I connect it directly to my development board?

Compatibility depends on the module interface, connector pinout, voltage levels, timing, and software support. Provide your board information for a compatibility review.

Shenzhen Sinoseen Technology Co., LTD

China top 10 camera module manufacturer

If you are struggling to find the right camera module solution, please contact us,

we will customize all kinds of USB/MIPI/DVP interface camera modules according to your needs,

and have a dedicated team to provide you with the most suitable solution.

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